Release films
Daikin’s NEOFLON FEP and NEOFLON PFA films are used as a mold release material during the curing process of thermosetting resins. These fluoropolymer films are stable and flexible at the high temperatures of the curing process. A high mold conformity can be obtained with fluoro-materials due to their high elongation rate.
Release films for CFRP
Required characteristics
- Non-adhesive properties
- Mechanical properties (tensile strength, elongation)
- Flexibility
- Thermal resistance
- Chemical resistance
- Oil resistance
Daikin Solutions
The CFRP (Carbon Fiber Reinforced Plastic) molding process requires a release film, like Daikin’s NEOFLON FEP, with excellent heat and chemical resistance to allow for the easy removal of parts from the mold after thermosetting. These films perform well in both autoclave and high temperature curing processes.
Release films for FPCB
Required characteristics
- Non-adhesive properties
- Mechanical properties (tensile strength, elongation)
- Flexibility
- Thermal resistance
- Chemical resistance
Daikin Solutions
Fluoropolymer film is used as a mold release material in the FPC (flexible printed circuit board) flat plate pressing process. The film adheres to a cushioning material, such as a silicone rubber plate, and is used repeatedly. In some cases, a single-sided surface treated film is used.
